We are in the middle of Computex 2022 and AMD has already laid its cards on the table. The company has just unveiled its new Ryzen 7000 desktop processors, which will be the first to incorporate the new Zen 4 architecture and which we will see on the market in the fall of 2022.
The Ryzen 7000 will surpass the 5 GHz barrier, as planned, and will be developed with a five-nanometer process. A significant advance, no doubt, but one that will have implications when it comes to integrating them into our computer, including the need to change the socket and, therefore, motherboard.
Power in abundance while awaiting exact models
AMD has not revealed the portfolio of processors that will be part of the Ryzen 7000 family. What we do know is that they will be based on Zen 4, AMD’s new five-nanometer architecture. As detailed by AMD, the new processors will double the amount of L2 cache per core and will feature higher clock speeds, offering “a more than 15% increase in single-threaded performance compared to the previous generation” and TDPs of up to 170W.
To demonstrate this, the company has shown the performance of a pre-production processor playing ‘Ghostwire Tokyo’ and, during the test, that processor reached no less than a speed of 5.5 GHz, thus matching the 5.5 GHz (turbo) of the Intel Core i9-12900KS. On the other hand, AMD claims that it is “30% faster than an Intel Core i9-12900K in a Blender multithreaded rendering workload”.
But the new features don’t stop there. The Ryzen 7000 will also feature a new six-nanometer I/O chip that includes an RDNA 2-based graphics engine, a new low-power architecture inherited from mobile Ryzen processors, support for DDR5, and PCI Express 5.0 and for up to four displays.
These new processors are accompanied by a new platform/socket, AM5, a successor to the long-lived AM4. This new socket has a 1,718-pin LGA design with support for TDPs up to 170W, dual-channel DDR5 memory, and SVI3 power. It also has 24 PCIe 5.0 lanes and support for current and future graphics cards. The AM5 family will have three chipsets:
- X670 Extreme: increased connectivity and overclocking capabilities with PCIe 5.0 support for two graphics slots and one storage slot.
- X670: supports overclocking with PCIe 5.0 support for one storage slot with optional graphics support.
- B650: with PCIe 5.0 storage support.
Now it is up to companies such as ASUS, Gigabyte, MSI, and companies to develop motherboards with this technology, while PCIe 5.0 storage solutions will be handled by firms such as Crucial, Micron, and Phison. All this we will see in autumn 2022.
AMD “Mendocino”, the new mobile processors
In addition to the new Ryzen 7000, AMD has revealed more information about the “Mendocino” family, the new mobile processors. These will be developed in a six-nanometer process, will incorporate four Zen 2 cores, and RDNA 2-based graphics seeks to offer greater autonomy and performance in the lower price ranges.
The goal? To offer notebooks with more than ten hours of autonomy at popular prices. We’ll see how this translates in the end. These “Mendocino” processors will arrive in the fourth quarter of 2022, so we will have to wait until then.
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